JBC is sponsoring the IPC Hand Soldering Competition at SMTA Tabletop Exhibition 2018
The competition will take place from 14th to 15th of August at the Eastin Hotel in Penang (Malaysia)
JBC is a Gold Sponsor of the IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2018, which will be held in Nuremberg (Germany) on June 5-7.
The contest will be held at INATRONICS 2018 on May 3-5.
The company will be providing live demonstrations of the JBC Net software along with the Dynamic Soldering Profiles functionality.
The company will be providing live demonstrations of the JBC Net software along with the Dynamic Soldering Profiles functionality.
The company showcases JBC Net system among other innovations.
The contest takes place on January during the Space Coast Expo & Tech Forum.
Once again the winner of the IPC Hand Soldering Competition at productronica 2017 became Nº 1 with a JBC station.
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